HPC/cALP-CSP-HP-B
787-HPC/CALP-CSP-HPB
HPC/cALP-CSP-HP-B
Fabricante:
Descripción:
Enfriadores de chips y CPU Standard passive cooling solution for COM-HPC module conga-HPC/cALP with integrated heat pipes, 28.2mm height. All standoffs are with 2.7mm bore hole.
Enfriadores de chips y CPU Standard passive cooling solution for COM-HPC module conga-HPC/cALP with integrated heat pipes, 28.2mm height. All standoffs are with 2.7mm bore hole.
Disponibilidad
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Existencias:
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Plazo de entrega de fábrica:
Precio (PEN)
| Cantidad | Precio unitario |
Precio ext.
|
|---|---|---|
| S/322.80 | S/322.80 | |
| S/290.42 | S/2,904.20 | |
| S/271.33 | S/6,783.25 | |
| S/267.55 | S/13,377.50 | |
| S/267.46 | S/26,746.00 | |
| 500 | Presupuesto |
